Sensor chip AU - plain gold surface
Plain gold surface (no dextran or hydrophobic coating). Provides the freedom to design customized surface chemistry using, for example, SAM (self-assembled monolayers) or other modifications. The sensor chip assembly is the same as all other sensor chips: the chip is attached to a plastic carrier inserted in a protective sheath. The assembly has limited resistance to organic solvents but is compatible with aqueous solutions.
Surface chemistry can be done prior or after docking the chip into the instrument. Modification prior to docking should be done with care. The side that interfaces with the opto-interface must be kept dry and free of dust. The sensor side should not be touched. The best way to apply solutions is in the corner of the sensor side.